JPH0415263U - - Google Patents
Info
- Publication number
- JPH0415263U JPH0415263U JP5513290U JP5513290U JPH0415263U JP H0415263 U JPH0415263 U JP H0415263U JP 5513290 U JP5513290 U JP 5513290U JP 5513290 U JP5513290 U JP 5513290U JP H0415263 U JPH0415263 U JP H0415263U
- Authority
- JP
- Japan
- Prior art keywords
- pins
- guide hole
- electronic component
- circuit board
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5513290U JPH0415263U (en]) | 1990-05-26 | 1990-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5513290U JPH0415263U (en]) | 1990-05-26 | 1990-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415263U true JPH0415263U (en]) | 1992-02-06 |
Family
ID=31577815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5513290U Pending JPH0415263U (en]) | 1990-05-26 | 1990-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415263U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228990A (ja) * | 1988-07-19 | 1990-01-31 | Seiko Epson Corp | 半導体装置の実装方式 |
-
1990
- 1990-05-26 JP JP5513290U patent/JPH0415263U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228990A (ja) * | 1988-07-19 | 1990-01-31 | Seiko Epson Corp | 半導体装置の実装方式 |